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TP450 Double-Sided PCB bulit on 2.5mm thick substrates with ENIG Finish for High-Frequency Applications

Shenzhen Bicheng Electronics Technology Co., Ltd
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TP450 Double-Sided PCB bulit on 2.5mm thick substrates with ENIG Finish for High-Frequency Applications

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Brand Name : Wangling

Model Number : TP450

Certification : ISO9001

Place of Origin : China

MOQ : 1PCS

Price : 0.99-99USD/PCS

Payment Terms : T/T, Paypal

Supply Ability : 50000pcs

Delivery Time : 2-10 working days

Packaging Details : Packing

Minimum Hole Size : 0.2mm

Impedance Control : No

Board Type : 2-Layer PCB

Layer Count : 2

Customer Support : 24/7 customer support

Lead Time : 3-5 working days

Customization : Customizable themes and layouts

Min. Hole Size : 0.2mm

Min. Hole Size With Copper Filled : 0.4mm

Surface Finish : ENIG

Coverlay Colour : No

Final Foil : 1.0 Oz

Minimum Trace Spacing : 0.1mm

Product Copper Thickness : 0.5-6.0oz

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Double-Sided PCB with TP450, 2.6mm Thickness, ENIG Finish for High-Frequency Applications

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 

1. Overview of the Double-Sided PCB

Our double-sided PCB is built with TP450, a unique thermoplastic material that combines ceramic fillers and polyphenylene oxide resin (PPO) for superior dielectric performance. With a 4.5 dielectric constant (Dk) and low dissipation factor (Df) of 0.0010 at 10 GHz, this PCB ensures signal integrity and minimal signal loss, even in demanding environments.

 

The ENIG surface finish enhances solderability and provides excellent corrosion resistance, while the 2-layer rigid design ensures structural stability. Although this PCB does not include solder masks or silkscreens, it is manufactured with 100% electrical testing to ensure performance and compliance with IPC-Class-2 standards.

 

TP450 Double-Sided PCB bulit on 2.5mm thick substrates with ENIG Finish for High-Frequency Applications

 

2. PCB Construction Details

Parameter Specification
Base Material TP450
Layer Count Double-sided
Board Dimensions 121mm x 125mm ± 0.15mm
Minimum Trace/Space 6/4 mils
Minimum Hole Size 0.5mm
Via Type No Blind Vias
Finished Board Thickness 2.6mm
Finished Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Electroless Nickel Immersion Gold (ENIG)
Top Solder Mask None
Bottom Solder Mask None
Top Silkscreen None
Bottom Silkscreen None
Electrical Testing 100% tested to IPC-Class-2 standards

 

 

 

3. PCB Stackup

The 2-layer rigid PCB stackup is straightforward yet effective for high-frequency designs. The stackup structure is as follows:

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material TP450 2.54mm (100mil)
Copper Layer 2 Copper (1oz) 35 μm

 

 

 

4. Features of TP450 Material

  • Dielectric Constant (Dk): 4.5 ± 0.2 at 10 GHz, ensuring stable signal transmission.
  • Dissipation Factor (Df): 0.0010 at 10 GHz for minimal signal loss.
  • Thermal Stability: Low TCDk: -50 ppm/°C, ensuring stable dielectric performance over temperature changes.
  • CTE: X-axis: 50 ppm/°C. Y-axis: 50 ppm/°C. Z-axis: 60 ppm/°C.
  • Excellent reliability over a wide temperature range (-55°C to 150°C).
  • Moisture Absorption: 0.01%, ensuring consistent performance in humid environments.
  • Flammability Rating: UL 94 V-0 for enhanced safety.
  • Thermal Conductivity: 0.44 W/mK, providing effective heat dissipation.

 

 

 

 

5. Benefits of TP450 Material

 

  • Low Dielectric Loss: Ensures high signal integrity for RF and microwave applications.

 

  • Thermal and Mechanical Reliability: With excellent CTE and thermal conductivity, it performs well in extreme environments, including space and defense applications.

 

  • Stable Dielectric Constant: The Dk is tightly controlled and remains consistent across a wide temperature range, making it suitable for precision applications.

 

  • Moisture Resistance: Low moisture absorption ensures consistent performance in humid or marine environments.

 

  • Cost-Effective Manufacturing: The material is compatible with standard PCB processes, reducing production costs without compromising quality.

 

TP450 Double-Sided PCB bulit on 2.5mm thick substrates with ENIG Finish for High-Frequency Applications

 

6. Applications of the Double-Sided PCB

 

Global Satellite Navigation Systems: Used in high-precision satellite communication and navigation devices.

 

Missile-Borne Applications: Ensures reliability in extreme environments with high vibration and thermal stress.

 

Miniaturized Antennas: Perfect for compact, high-performance RF antenna designs.

 

Fuze Technology: Ideal for sensitive and precision-guided systems.

 

 

The TP450-based double-sided PCB delivers excellent performance for critical RF and microwave systems, making it a reliable choice for advanced applications.

 

 

Why Choose Bicheng Technologies?

At Bicheng Technologies Limited, we specialize in designing and manufacturing high-quality PCBs for RF and microwave applications. Our double-sided PCB with TP450 material is manufactured to the highest standards, offering exceptional performance, reliability, and value.

 

 

Why Work With Us?

Global Reach: We deliver worldwide, ensuring timely support for your projects.

Quality Assurance: All PCBs are tested to IPC-Class-2 standards for guaranteed reliability.

Customer Support: We provide tailored solutions to meet your specific project requirements.

 

If you’re looking for a trusted partner for your next high-frequency project, feel free to contact Sally at sales30@bichengpcb.com. Let’s work together to bring your innovative designs to life.

 

TP450 Double-Sided PCB bulit on 2.5mm thick substrates with ENIG Finish for High-Frequency Applications

 


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