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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold

Brand Name : Bicheng Technologies Limited

Model Number : BIC-504-V0.54

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-9.99 PER PIECE

Payment Terms : T/T, Western Union

Supply Ability : 45000 pieces per month

Delivery Time : 10 working days

Packaging Details : Vacuum

Number of Layers : 4

Glass Epoxy : S1000-2M

Final foil : 1 Oz

Final height of PCB : 1.6 mm ±10%

Surface Finish : Immersion Gold

Solder Mask Color : Gloss Green

Colour of Component Legend : White

Test : 100% Electrical Test prior shipment

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High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
General Description
S1000-2M is a type of High Tg printed circuit board material manufactured by Shengyi with characteristics of high performance and low CTE, suitable for high multilayer PCB. The thickness ranges 0.05mm to 3.2mm, copper weight 0.5oz to 3oz etc.
Features
Lead-free compatible FR-4 laminate
Tg170℃ (DSC), UV Blocking/AOI compatible
High heat resistance
Lower Z-axis CTE
Excellent through-hole reliability
Excellent Anti-CAF performance
Low water absorption
Excellent mechanical processability
 
High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
 
 
Applications
Computer
Communication
Automotive electronics
Suitable for high layer count PCB
 
Our PCB Capability (S1000-2M)

PCB Material:High Tg, High Performance and Low CTE Epoxy Resin
Designation:S1000-2M
Dielectric constant:4.6 at 10GHz
Layer count:Double Layer, Multilayer, Hybrid PCB
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB thickness:0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 
 High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold
General Properties of S1000-2M

Test ItemsTest MethodTest ConditionUnitTypical Value
TgIPC-TM-650 2.4.24.4DMA℃185
IPC-TM-650 2.4.25DDSC℃180
TdIPC-TM-650 2.4.24.6TGA (5% W.L)℃355
T260IPC-TM-650 2.4.24.1TMAmin>60
T288IPC-TM-650 2.4.24.1TMAmin30
T300IPC-TM-650 2.4.24.1TMAmin15
Thermal StressIPC-TM-650 2.4.13.1288℃, solder dips>100
CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃41
IPC-TM-650 2.4.24After Tgppm/℃208
IPC-TM-650 2.4.2450-260℃%2.4
Permittivity (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-4.6
Loss Tangent (1GHz)IPC-TM-650 2.5.5.9C-24/23/50-0.018
Volume ResistivityIPC-TM-650 2.5.17.1C-96/35/90MΩ-cm8.7×108
Surface ResistivityIPC-TM-650 2.5.17.1C-96/35/90MΩ2.2×107
Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-0.5/23s133
Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-0.5/23kV>45
Peel Strength (1oz)IPC-TM-650 2.4.8288℃/10sN/mm [lb/in]1.3 [7.43]
Flexural Strength (LW/CW)IPC-TM-650 2.4.4AMpa567/442
Water AbsorptionIPC-TM-650 2.6.2.1D-24/23%0.08
FlammabilityUL94C-48/23/50RatingV-0
CTIIEC60112ARatingPLC 3

 
High Tg Printed Circuit Board (PCB) on S1000-2M Core and S1000-2MB Prepreg with Immersion Gold



























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