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BICHENG ENTERPRISE LIMITED Specialized in heavy copper PCBs for 15 years High Frequency PCB | Metal Core PCB | Flexible PCB 90% export | UL, ISO 9001, ISO14001 and TS 16949 certified
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Impedance Controlled PCB Built On RO4003C With Immersion Gold

Impedance Controlled PCB Built On RO4003C With Immersion Gold

Brand Name : Bicheng Enterprise Limited
Model Number : BIC-0557-V5.57
Certification : UL
Place of Origin : China
MOQ : 1
Price : USD20~30
Payment Terms : T/T, Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 4-5 working days
Packaging Details : Vacuum
Glass Epoxy : RO4350B Tg280℃, er<3.48, Rogers Corp.
Final height of PCB : 1.6 mm ±10%
Final foil external : 1.5 oz
Surface Finish : Immersion gold (31%)
Solder Mask Color : N/A
Colour of Component Legend : Black
TEST : 100% Electrical Test prior shipment
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General Profile

Impedance controlled PCB's are used more and more popular in our common
life: Synchronous digital hierarchy (SDH), GSM, CDMA, PC and high power
wireless phone etc.

Basic elements that affect impedance

1) Thickness of trace (T1) 7%
2) Width of trace (W1) 4%
3) Height of laminate (H1) 35%
4) Dielectric constant of board material (Er1) 8%
5) Other factors can be involved, however they have much less affect on the
impedance such solder resist, thickness of tin and lead, PCB humidity etc

Main factors affected impedance control (normally ±10%)

1) Generally, desinged width of trace is already fixed, manufacturing procedure
is controlled within ±15-20%
2) Generally, the thickness of trace is already fixed at designing period,
manufacturing procedure of electroplate is controlled within ±0.8-1.2mil
3) The dielectric constant of the substrate is almost fixed, no much big changes.
4) The above-mentioned factors can be controlled stably, the main affecting factor
of impedance control is only left height of laminate.

Main factors to the height of laminate

1) thickness of inner layer copper
2) residual rate of inner layer copper
3) use which kind of prepreg

Testing the PCB

PCB testing is normally done on one test coupon integrated into the PCB panel,
not on the PCB itself. Coupons are designed for specific time domain reflectometer.

Printed Circuit Board Capability

 Layer Counts 1-32
 Substrate MaterialFR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; Polyimide, 94HB and FR-1 (upon request)
 Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance ±0.0059" (0.15mm)
 PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm) ±8%
Thickness Tolerance(t<0.8mm) ±10%
 Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track0.003" (0.075mm)
 Minimum Space 0.003" (0.075mm)
 Outer Copper Thickness 35µm--420µm (1oz-12oz)
 Inner Copper Thickness 17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical)0.00295" (0.075mm)
 Registration (Mechanical)0.00197" (0.05mm)
 Aspect Ratio 12:1
 Solder Mask Type LPI
 Min Soldermask Bridge0.00315" (0.08mm)
 Min Soldermask Clearance0.00197" (0.05mm)
 Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance ±10%
 Surface FinishHASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

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